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Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection

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Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection

Brand Name : UNICOMP

Model Number : AX7900

Certification : CE, FDA

Place of Origin : China

MOQ : 1Set

Delivery Time : 15 work days

Price : can negotiate

Payment Terms : L/C,T/T

Supply Ability : 30 sets per month

Packaging Details : Wooden Case, Waterproof, Anti-collision

Pixel Matrix : 1536*1536[pixel]

Frame Rates : Max30fps

RAM : 16G

CPU Model : i7 6 generation

Power consumption : 0.8KW

Type : Electronic semiconductor

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Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection


Description of BGA X-Ray machine AX7900:


Equipped with 90kV / 5μm micro-focus X-ray tube and high-performance FPD detector, AX7900 adopts a multifunctional workstation design. It features standard XY multi-axis motion with optional ±60° tilt. Independent Z-axis movement of X-ray tube and FPD allows flexible adjustment of magnification and FOV. Integrated with target positioning system and professional DXI image software, it supports XY programming for batch inspection routines. Max loading area 420×420mm, max detection area 380×380mm, system magnification up to 300X.


APPLICATION of IC Xray machine AX7900:

  • LED, SMT, BGA, CSP, Flip Chip Inspection.
  • Semiconductor, Packaging components, Battery Industry.
  • Electronic components, Auto parts, Photovoltaic Industry.
  • Aluminum Die Casting, Moulding Plastic.
  • Ceramics, Other Special Industries


FEATURES of IC Xray machine AX7900:

  • 90KV 5μm X-ray tube, FPD Detector.
  • Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
  • Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option).
  • Multi-function DXI image processing system.
  • X/Y programming function for multiple image inspection routines
  • Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
  • BGA void/area auto-measurement plus report generation.



Technical Specifications of AX7900


Item Definition Specs
System Parameters Size 1215(L)x1325(W)x1700(H)mm
Weight 1240kg
Power 220V±10% 50Hz/60Hz 4A
Power Consumption 0.8kW
X-ray Tube Type Closed
Max.Voltage 90kV
Max.Power 8W
Spot Size 5μm
X-ray System Intensifier FPD
Monitor 24 ‘’HD
Geometric Magnification 52X
Detection Region Max.Loading Size 600mm x 520mm
Max.Inspection Area 505mm x 440mm
X-ray Leakage <1μSv/h



Inspection Images of IC X-Ray machine AX7900:


Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection

Application Fields

Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection


Dimensions and appearance

Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection


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Quality Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection for sale

Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection Images

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