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Auto Void Detection High Motion Precision BGA Solder Joint Xray Equipment AX8300 Unicomp Quality Control

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Auto Void Detection High Motion Precision BGA Solder Joint Xray Equipment AX8300 Unicomp Quality Control

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Brand Name : UNICOMP

Model Number : AX8300

Certification : CE, FDA

Place of Origin : China

MOQ : 1Set

Delivery Time : 15 work days

Price : can negotiate

Payment Terms : L/C,T/T

Supply Ability : 30 sets per month

Packaging Details : Wooden Case, Waterproof, Anti-collision

Warranty : 1 year

Pixel Matrix : 1536*1536[pixel]

Frame Rates : Max30fps

RAM : 16G

Hard Disk : 1TB HDD

Type : Electronic semiconductor detection equipment

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Unicomp X-ray Detector AX8300



The AX-8300 is professionally engineered to satisfy high-precision visual inspection requirements for PCBA assemblies.
It pioneers the adoption of a customized 110kV micro-focus X-ray source within the industry, acting as an optimal intermediate-grade solution. It delivers balanced penetrating capability, effectively compensating for the insufficient energy of 90kV equipment while avoiding the excessive radiation power of 130kV models.
Featuring a high-end flat-panel detector (FPD), the AX-8300 captures ultra-magnified, high-resolution imaging with finesse equivalent to premium 90kV micro-focus X-ray systems. Moreover, the integrated 360° rotary worktable enables omnidirectional multi-angle scanning, facilitating comprehensive dimensional and defect assessment.



Features:


  • Point-and-Click Positioning Navigation
  • CNC Programmable Multi-scan Inspection Modes
  • 110kV Microfocus X-ray Source
  • High Resolution FPD Detector
  • X/Y/Z and Tilt Motions for Table, Tube and FPD
  • 360° Worktable Rotation
  • Wide Angle View up to 70°
  • Maximum Inspection Area: 360 × 340 mm



Application:


1. BGA/CSP/FLIPS CHIP: Bridging ,Voids,Opens,Expcessive/insufficient


2. QFN: Bridging,Voids,Opens,Registration


3. SMT Standard components: QFP,SOT,SOIC,Chips,Connectors,Others


4. Semiconductor: bond wire,die attach VOID ,MOLD,VOID


5. Multi-layer board(MLB): Inner layer registration,PAD stack,blind/buried vias



Model

AX8300

Max kV/type

110 kV/Sealed

Power Consumption

900W

Max.Electron beam power

25W

Focal spot size

5μm

Geometric magnification

49.8X

Imaging system(Option)

Flat Panel Detector

Monitors

27" HD 4K display

Product Dimensions

1200x1285x1700mm

Weight

1345kg

Radiation safety

<1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm

Control

Keyboard/Mouse/Joystick

Automated inspection

Standard

Primary applications

Chip inspection/Electronic components/Auto parts.etc

1.Focal spot size is a variable.Please consult the unicomp

2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the

FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2"from any external surface.Our machines are typically 15times less emission.



Inspection Images:





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Quality Auto Void Detection High Motion Precision BGA Solder Joint Xray Equipment AX8300 Unicomp Quality Control for sale

Auto Void Detection High Motion Precision BGA Solder Joint Xray Equipment AX8300 Unicomp Quality Control Images

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