AI High-Resolution PCBA BGA Unicomp X-ray AX7900 SMT Assembly Testing Equipment

Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment

Description of X-Ray machine AX7900:

Adopts high-performance 90kV micro-focus X-ray tube with 5μm focal spot and high-sensitivity FPD flat panel detector. Built with precision multi-axis XY motion platform, optional ±60° oblique viewing angle is available. Independent Z-axis adjustment for X-ray source and detector freely optimizes imaging magnification and detection field range.Precise optical point positioning assists rapid sample alignment. Integrated professional DXI image processing software supports programmable XY path inspection, realizing efficient batch multi-position quality testing. It supports maximum loading size 420×420mm, effective inspection area 380×380mm, and delivers stable system magnification up to 300X.

APPLICATION of IC Xray machine AX7900:

• LED, SMT, BGA, CSP, Flip Chip Inspection.
• Semiconductor, Packaging components, Battery Industry.
• Electronic components, Auto parts, Photovoltaic Industry.
• Aluminum Die Casting, Moulding Plastic.
• Ceramics, Other Special Industries

FEATURES of Xray machine AX7900:

• 90KV 5μm X-ray tube, FPD Detector.
• Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
• Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option).
• Multi-function DXI image processing system.
• X/Y programming function for multiple image inspection routines
• Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
• BGA void/area auto-measurement plus report generation.

Technical Specifications of AX7900

Application Fields

Inspection Images of IC X-Ray machine AX7900:

airport security x ray machine

security x ray machine

AI High-Resolution PCBA BGA Unicomp X-ray AX7900 SMT Assembly Testing Equipment Images