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7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment

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7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment

  • 1
  • 2

MOQ : 1 Set

Delivery Time : 30 days

Size : 1485(L)x1420(W)x1710(H)mm

Payment Terms : T/T,L/C

Application : SMT, EMS,BGA, Electronics, CSP , LED, Semiconductor

Industry : Electronics Industry

Price : can negotiate

Tube Voltage : 130KV

Power Consumption : 1.2kW

Certification : CE, FDA

Supply Ability : 30 sets per month

Name : X Ray Pcb SMT Inspection Machine

Warranty : 1 Year

Place of Origin : China

Packaging Details : Wooden Case, Waterproof, Anti-collision

Model Number : AX9100

X-ray Leakage : < 1uSv/h

Brand Name : Unicomp

Weight : 2070kg

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7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment
Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications.
Key Features
  • 130KV 7μm X-Ray tube for precise imaging
  • High speed & millions pixels high resolution FPD
  • 1600X magnification with high-definition real-time image display
  • One-button operation with 2.5D image display
  • Off-line programming function with navigation mode detection
  • 7 axis linkage with 70 degree tilt detection capability
Applications
  • SMT, BGA, CSP, Flip Chip, LED Detection
  • Semiconductor and Packaging components
  • Battery Industry and Electronic components
  • Auto parts and Photovoltaic Industry
  • Aluminum Die-casting and Moulding Plastic
  • Ceramics and Other Special Industries
Technical Specifications
System Parameters Definition Specs
Size 1485(L)x142(W)x1710(H)mm
Weight 2070kg
Power 220V±10% 50Hz/60Hz 5A
Power Consumption 1.2kW
X-ray Tube Type Closed
X-ray Tube Max. Voltage 130kV
X-ray Tube Max. Power 65W
X-ray Tube Spot Size 7μm
X-ray System Intensifier FPD
X-ray System Monitor 27'' HD
X-ray System System Magnification 1600 X
Detection Region Max. Payload Size 645*670[mm]
Detection Region Max. Detection size 565*510[mm]
Detection Region X-ray Leakage <1μSv/h
Our Services
  • Product project analysis and detection solutions
  • Free sample detection testing
  • Professional detection solution development
  • Skilled jig design services
  • Shipping/delivery information checking service
  • One year guarantee with lifetime maintenance
  • 24-hour email response time
Frequently Asked Questions
How about the package? Is it safe during the delivery?
All X-ray inspection machines are packed in standard strong wooden cartons to ensure safe shipping.
Do you provide the Warranty? How about the after sales service?
1 year warranty free for spare parts with lifetime technical support. Our professional after-sales team provides assistance videos and comprehensive support.
If we come to your factory, will you provide free training?
Yes, we warmly welcome visitors to our factory and provide complimentary training sessions.
Application Examples
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment
Product Images
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment

Product Tags:

7μm semiconductor bonding wire Xray

      

IC chip packaging testing equipment

      

UNICOMP Xray machine for semiconductors

      
Quality 7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment for sale

7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Images

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