Sign In | Join Free | My infospaceinc.com
China Unicomp Technology logo
Unicomp Technology
Verified Supplier

9 Years

Home > Electronics X Ray Machine >

Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis

Unicomp Technology
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis

  • 1
  • 2

Brand Name : UNICOMP

Model Number : AX8300MAX

Certification : CE, FDA

Place of Origin : China

MOQ : 1Set

Price : can negotiate

Payment Terms : T/T,L/C

Supply Ability : 30 sets per month

Delivery Time : 30 days

Packaging Details : Wooden Case, Waterproof, Anti-collision

Motion Control Mode : Mouse & Keyboard & Joystick

Tilt and Rotation : Detector unilateral tilt maximum 60°

Monitor : 27"HD 4K display

System OS : Windows11 64-bit

Power Consumption : 900W

Contact Now

Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX
Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing.
Applications
This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components.
Key Features
  • Professional semiconductor inspection configuration with 5 μm ultra-high resolution
  • Extended detection scope, supporting high-efficiency batch inspection and mass production testing
  • Dual rocker mechanical design, enabling flexible and precise manual operation
  • Compatible with 2D and 2.5D detection, with expandable 3D detection function
  • Dual-screen interactive design, supporting multi-task parallel operation and improving inspection efficiency
  • Integrated dedicated AI algorithm for automated semiconductor defect detection
Technical Specifications
Product Name AX8300MAX
Dimension 1286(W)*1540(D)*1700(H)[mm]
Machine Weight 1530kg
Power Supply 220V±10% 50Hz/60Hz 4A
Detector High resolution FPD
Voltage 110kV
Power 900w
Tube Type Sealed
Max. Power 20W
Detection Area 129*129[mm]
Pixel Matrix 1536*1536[pixel]
Frame Rates Max 30fps
Geometric Magnification 47.7X
System Functions
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis
Inspection Sample Images
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis
Frequently Asked Questions
How about the package? Is it safe during delivery?
All X-ray inspection machines are packed with standard wooden solid cartons. This ensures safe shipping and delivery.
Do you provide warranty? How about the after-sales service?
1-year warranty free for spare parts with lifetime technical support. We have a professional after-sales team and provide assistant videos for troubleshooting.
If we come to your factory, will you provide free training?
Yes, we warmly welcome you to visit our factory and will arrange comprehensive free training for your team.
Our Services
  • Help customers analyze product projects and provide detection solutions
  • Provide professional detection solutions
  • Skilled jig design services
  • 24-hour feedback speed by email and other channels
  • Free sample detection testing
  • Provide shipping/delivery information checking service
  • One year guarantee with lifetime maintenance promise

Product Tags:

BGA solder joint X-ray machine

      

AX8300MAX auto void analyzer

      

Unicomp electronics inspection machine

      
Quality Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis for sale

Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Unicomp Technology
*Subject:
*Message:
Characters Remaining: (0/3000)